Transistor headers
Electrovac has over 60 years of know-how in transistor header production.
In the past, transistor packages or TO headers in standard dimensions were manufactured as a mass product to keep manufacturing costs as low as possible.
Depending on the glass seal technology, two different types of metal are used:
- As a compression glass feedthrough: cold-rolled steel with NiFe or kovar pins
- As a matched glass feedthrough: kovar or alloy 42 with kovar pins
The base plates or caps are fabricated in our own stamping facility using stamping or deep drawing technology.
Depending on customer requirements and the further processing method, transistor headers are nickel or gold plated.
From small quantities to highly automated million-item manufacture, Electrovac supplies the following TO headers:
Design: shelled
Outside Dia in mm: 9,2
Plateau Dia in mm: 7,67
Design: stamped
Outside Dia in mm: 12,7
Plateau Dia in mm: 10,8
Design: stamped
Outside Dia in mm: 15,25
Plateau Dia in mm: 13,35
Design: shelled
Outside Dia in mm: 5,4
Plateau Dia in mm: 4,24
Design: stamped
Outside Dia in mm: 9,13
Plateau Dia in mm: 7,67
Design: stamped
Outside Dia in mm: 5,4
Plateau Dia in mm: 4,24
On customer request, Electrovac will also supply the accompanying TO caps along with the transistor headers.
Because of the large number of existing TO variants, we do not offer standard catalogues, but develop and manufacture according to customer requirements and design variations.